AssmannHeat sinks

ASSMANN WSW group is the gold standard of thermal management. Decades of experience in developing, creating and manufacturing have resulted in a wide selection of heat sink profiles – customized as well as standard.
ASSMANN WSW group has a variety of standard heat sinks based on stamped or extruded base materials, many of them in stock.




 

   

Finger- and U-shaped heat sinks

 

Heat sinks for IC components TO-220/ SOT-32/ D-PAK
Thermal resistance: 7 K/W - 80 K/W
Mounting options: THT/ SMT/ Screw mounted
Mounting direction: 180°, 90°
Surface: AL degreased, anodized, tinned
Material: AL1050, Cu1100
Packaging: Polybags, carton, tray and T&R
Special: Threads, holes



   

Attachable heatsinks



 

Heat sink for package TO-220/ TO-218
Thermal resistance: 13 K/W - 63 K/W
Mounting options: THT, Pressure connection (spring power)
Mounting direction: 180°, 90°
Surface: AL degreased, anodized, tinned
Material: AL1050, Cu1100
Packaging: Polybags, carton, tray and T & R
Special: Threads, holes



   

Extruded heatsinks with solder pins



 

Heat sinks for package TO-220/ TOP-3/ SOT-32
Thermal resistance: 3,5 K/W - 38 K/W
Mounting options: THT, screw mounted
Mounting direction: 180°, 90°
Surface: AL degreased, anodized, tinned solder pins
Material: AL6060, AL6063
Packaging: Carton, tray
Special: Retaining clamps



   

SMD and copper heat sinks

 

Heat sinks for D-PAK-Series and TO-220 packages
Thermal resistance: 11 K/W - 24 K/W
Mounting options: SMD & Pressure contact (spring power)
Mounting direction: 180°, 90°
Surface: Tinned
Material: Cu1100
Packaging: Polybags, carton, tray and T&R
Special: Complete tinned surface finish


 

   

Extruded heat sinks
- in standard lengt
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Heat sinks for different applications like industrial, telecom and consumer applications
Thermal resistance: 1,5 K/W - 40 K/W
Mounting options: Screw mounted
Mounting options: 180°, 90°
Surface: AL degreased, anodized
Material: AL6063, AL6060
Packaging: Carton
Special: Profiles with M3 thread (extruded), hole patterns



   

CPU heat sinks

 

CPU heat sinks and processor stamp heat sinks
Thermal resistance: 3,7 K/W - 32 K/W
Mounting options: THT, Push Pins, thermal adhesive pads, glue
Mounting direction: 180°
Surface: AL degreased, anodized
Material: AL6063, AL1050, AL5052
Packaging: Carton, tray
Special: Cross Cut-, Pin Fin-, or Stamped heat sink version with or without mounted thermal pads

   

Profile extruded heat sinks

 

Customer specific profile heat sinks with customer tailored mechanical treatment
Thermal resistance: <1K/W depending on the type of profile
Mounting options: Screw mounted
Mounting direction: 180°, 90°
Surface: AL degreased, anodized
Material: AL6063, AL6060
Packaging: Carton
Special: Milling, drilling, turning, polishing and anodizing according to customer requirement

   

Retaining springs

 

Customer specific and product specific fixing solutions
Thermal resistance: Not applicable
Mounting options: Manual mounting process
Mounting direction: According to the chosen heat sink profile
Surface: Degreased
Material: Spring steel SUS301
Packaging: Polybag
Special: High contact press force, cost saving assembly process

   

Mounting accessories

 

Single-component-adhesive, thermal compound, thermal conductive ceramic pads, insulating washers, stand-off s, insulating mica wafers
Type of adhesive: Single-component-adhesive in 30g plastic pen with screw top or 3g tube with screw top
Thermal compound: Silicon thermal or non-silicon-thermal compound based on 15g up to 25kg size packaging, temperature range -40 – +150°C
Thermal conductive pads: Material: glass fiber reinforced ceramic silicon pads, material C20, temperature range -60°C – +200°C
Insulating washers: Material: SR25, heat resistant up to 215°C
Insulating mica wafers: Material: Polypropylene, heat resistant up to 110°C
Packaging: Tubes, cans, buckets (adhesive & thermal compound) /
Polybags (insulating washers & insulating mica wafers)/ tray (foils & pads)

   

Distance rolls

 

Distance rolls and spacers
Mounting options: Screw mounted
Mounting direction: 180°
Surface: Zinc-plated (steel - version), nickel-plated (brass - version)
Material: Brass. Steel, polyamide
Packaging: Polybag
Special: Different lengths and width across flats (5 / 5,5/ 6/ 7/ 8/ 10),
various inner threads (M2,5/ M3/ M4/ M5/ M6)

   

Customer tailored heat sink solutions

 

A customized process begins with an analysis of application needs, utilizing a thermal calculation, creating a product that meets your specific needs in fit form and function. The results of the analysis are used to create a sample production and are modified until specifications are met. Then the series production starts for a highly refined customized heat sink. ASSMANN WSW group provides short logistical lead times, cost competitiveness and manage the complexities of creating, developing and manufacturing your customized heat sinks. Customers benefit from our vast range of existing profiles for their application. As added value, ASSMANN WSW components offers a customized treatment tailored to your needs of the final profile which include sawing of the heat sink and CNC machine treatment includes milling, drilling holes and threads, turning or polishing. To give the heat sink its final surface the ASSMANN WSW group offers the anodized for standard and décor. As a standard, AL6060 (European) and AL6063 (Asian) materials are used, however different alloys are available.

   

Customer tailored profiles - based on customer tailored press tools



 

Thermal resistance: Depending on the chosen product and profile
Connection technology: Screwing, THT
Connection direction: 180°
Surface: Anodized, tinned, untreated
Material: AL6063, AL6060, AL1050, AL1052, AL5052
Packaging: Polybag, tray, carton, T&R
Special: Special decor surfaces available
Manufacturing: Manufacturing of profile heat sinks in Europe and Asia
Advantages: Large range of profile press tools available, project management in Germany, competitive manufacturing, long term product experience



Find more detailed information about the Assmann product range by clicking here.